77 GHz radar high-frequency board
- Layers
- 18
- Materials
- TSM-DS3 + FR28 prepreg + S1000-2M, hybrid lamination
- Finish
- Immersion gold (ENIG)
- Special process
- Pure PTFE blind/buried-via impedance board, 5 back-drill groups
PCB Manufacturing · Standard & Advanced PCB
High-Frequency PCB
Circuit boards for RF and microwave designs where dielectric properties, loss and stability matter.
Standard & Advanced PCB
High-Frequency PCB with ShinePCB
High-frequency boards rely on laminates such as Rogers, Isola and PTFE-based materials. We review your frequency, loss and stability targets, compare material options and confirm availability before quotation. Supplier datasheet values are material data, not fabrication guarantees.
- Laminate selection against your targets
- Hybrid stack-ups with FR-4 where useful
- Copper surface and finish considerations
- Impedance and test requirements
Capability and certificates
| Positioning | Rogers / Isola / PTFE | |
|---|---|---|
| Standard / prototype | Advanced / mass production | |
| High-Frequency PCB | 24L | 20L |
Related certificates
- ISO 9001:2015133628
- UL 796E466435
- IECQ QC 080000IECQ-H NQAGB 25.0038
Source: ShinePCB capability workbook, navigation overview. Values are confirmed against your files and the assigned facility during engineering review; certificates are available on request.
High-frequency capability
| Parameter | Prototype | Mass production |
|---|---|---|
| Material system | PTFE, hydrocarbon resin, other materials | PTFE + ceramic, PTFE + glass fiber + ceramic, PTFE + glass fiber |
| Layer count (max) | 24L | 20L |
| Panel size (max) | 850 × 700 mm | 720 × 650 mm |
| Profile tolerance | ±0.05 mm | ±0.10 mm |
| Slot tolerance | Normal slot ±0.08 mm, routed slot ±0.10 mm | Normal slot ±0.10 mm, routed slot ±0.13 mm |
| Layer registration | 2 mil | 3 mil |
| Hybrid lamination | PTFE + glass ceramic + FR-4 | PTFE + glass ceramic + FR-4 |
| Min hole size | 0.075 mm | 0.10 mm |
| Min hole spacing | 0.20 mm | 0.25 mm |
| Hole diameter tolerance | ±0.05 mm | ±0.075 mm |
| Max aspect ratio | 16:1 | 12:1 |
| Hole copper uniformity | COV ≤ 5% | COV ≤ 7% |
| Resin-filled via aspect ratio | 12:1 | 12:1 |
| Resin-filled via type | Through hole / blind via | Through hole / blind via |
| Trace width tolerance | ±0.6 mil | ±1 mil |
| Impedance tolerance | ±5% | ±8% |
| Warpage | 0.50% | 0.75% |
| Special processes | POFV (VIPPO), sequential lamination, local lamination, long/short gold finger, counterbore, back drill, side metallization, N+N structure, edge plating, thick copper, HDI | Same processes as prototype |
| Approved material brands | Shengyi, ITEQ, Taiwan Union, Panasonic (M4/M6/M7/M8), Rogers, Taconic, Wangling, Ventec, Isola | Same brands as prototype |
Source: ShinePCB capability workbook (high-frequency & high-speed sheet has no year column). Prototype and mass-production values are listed separately and are not interchangeable. Every value is confirmed against your files, the selected material and the assigned facility during engineering review.
RF and microwave laminates
| Material | Series | Tg | Dk | Df | Typical use |
|---|---|---|---|---|---|
| Rogers RO3003 | RO3000 | — | 3.00 @ 10 GHz | 0.0013 | Microwave and RF |
| Rogers RO3006 | RO3000 | — | 6.15 @ 10 GHz | — | Microwave and RF |
| Rogers RO3010 | RO3000 | — | 10.2 @ 10 GHz | — | Microwave and RF |
| Rogers RO3035 | RO3000 | — | 3.50 @ 10 GHz | 0.0017 | Microwave and RF |
| Rogers RO4003C | RO4000 | >280 °C | 3.38 (process Dk) @ 10 GHz | 0.0027 | RF and microwave; hybrid boards |
| Rogers RO4350B | RO4000 | >280 °C | 3.48 (process Dk) @ 10 GHz | 0.0037 | RF and microwave; hybrid boards |
| Rogers RO4360G2 | RO4000 | — | — | — | RF and microwave; hybrid boards |
| Rogers RO4835 | RO4000 | — | — | — | RF and microwave; hybrid boards |
| Rogers RO4450 | Bonding material | — | — | — | RF hybrid lamination bonding |
| Arlon CLTE | Ceramic-filled PTFE | — | — | — | RF and microwave |
| Taconic RF-35 | Ceramic-filled PTFE | — | — | — | RF and microwave |
| Shengyi SCGA-500 GF220 | PTFE RF laminate | — | 2.2 | 0.0009 | RF and microwave |
| Shengyi SCGA-500 GF255 | PTFE RF laminate | — | 2.55 | 0.0014 | RF and microwave |
| Shengyi SG7350D / SG7350D2 | RF and microwave | — | 3.55 | 0.0020–0.0022 | RF and microwave |
| Shengyi mmWave77 | Millimeter wave | — | 3.0 | 0.001 | Automotive radar and millimeter wave |
| Shengyi LNB33C series | RF and microwave | — | 3.30–3.50 | 0.003–0.0035 | RF and microwave |
Source: ShinePCB capability workbook, material sheet. Dk, Df and Tg are typical supplier datasheet values (test frequency shown where the source lists it). They describe the laminate, not the finished board. Grades are available on request and confirmed with availability during engineering review. "—" means no value is listed in the source.
Selected RF builds
Board constructions from the ShinePCB company presentation — not customer references.
AI server high-speed board
- Layers
- 18
- Material
- Panasonic MEGTRON 8
- Thickness / min hole
- 3.1 mm / 0.15 mm
- Finish
- Full-board electrolytic hard gold
- Challenge
- High layer count, blind vias, thick gold over the full board
12-layer rigid-flex board
- Structure
- 12 layers, 4R + 4F + 4R
- Materials
- ITEQ IT-180 + DuPont AP9141R
- Thickness / min hole
- 1.6 mm / 0.2 mm
- Finish
- Immersion gold (ENIG)
- Application
- High-end industrial connector
Millimeter-wave antenna board
- Layers
- 8
- Material
- Rogers RT5880
- Finish
- Soft gold plating, 3 µm gold
- Special process
- Laser profiling
5G base-station power amplifier board
- Layers
- 4
- Materials
- Rogers RO4350B + FR-4
- Finish
- Immersion gold (ENIG)
- Special process
- Blind vias, step cavity, partially embedded copper block
Builds from the ShinePCB company presentation. They illustrate process scope and are not customer references.
Typical applications
Antennas and RF front ends
Radar and sensing modules
Wireless infrastructure
From prototype to production
Every order follows the same controlled sequence. Prototype and production requirements are reviewed separately.
File review
Gerber or ODB++, drill data, drawing and quantities are checked for completeness.
Engineering questions
Open points on manufacturability, materials or special processes are sent before quotation.
Stack-up and material
Construction, laminate and finish are confirmed with you and written into the order.
Fabrication
The order is released to the facility whose process and qualification fit the requirements.
Inspection and test
Inspection and electrical test follow the methods agreed for your order.
Packing and delivery
Boards are packed and shipped under the confirmed delivery terms.
What to send for a PCB review
Start with the details you have — engineering will request anything else needed for the review.
Files and details for a PCB review
- Gerber (RS-274X) or ODB++ data with drill files
- Fabrication drawing with material, thickness and finish
- Stack-up and impedance targets, if any
- Quantity for prototype and for production
- Special requirements such as IPC class, testing or packaging
Technical files stay private
Customer Gerber, BOM and design data are managed under an ISO/IEC 27001 information security system and shared only within your project.
High-Frequency PCB FAQs
Which RF material should I choose?
It depends on frequency, loss budget, thermal needs and cost. Share your targets and we will review suitable options.
Can RF and FR-4 layers be combined?
Hybrid stack-ups are reviewed per project for compatibility and processing.
